发明名称 Solvent-free two-component curable adhesive composition
摘要 The solvent-free two-component adhesive composition of the present invention comprises a polyol component (A) and a polyisocyanate component (B), and the viscosity of the mixture at 80° C. immediately after the point of time the components (A) and (B) are mixed together is 900 mPa.s or higher. The component (A) may be a polyol having a number average molecular weight of 800 or larger, or a mixture thereof, and the viscosity of the component (B) at 25° C. may be 20,000 mPa.s or higher. The composition may be used for laminating metal foil of 5 to 15 m thickness with a plastic film. By using the composition of the present invention, the occurrence of blocking due to the seepage of the adhesive from metal foil is prevented. The present invention includes a process of lamination using the same.
申请公布号 US2002143133(A1) 申请公布日期 2002.10.03
申请号 US20020108709 申请日期 2002.03.29
申请人 IMAI AKIHIRO;MORIMOTO TAIJI;IGARASHI SACHIO 发明人 IMAI AKIHIRO;MORIMOTO TAIJI;IGARASHI SACHIO
分类号 B32B15/08;C08G18/42;C09J175/06;(IPC1-7):C08G18/00 主分类号 B32B15/08
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