发明名称 RESIN SHEET AND MOLDED PRODUCT FOR FEEDING ELECTRONIC PARTS
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin laminated sheet excellent in mechanical physical properties such as folding endurance (hardness to crack), buckling strength, impact resistance, rigidity or the like and comprising respective layers uniform in thickness, and a molded product for feeding electronic parts formed using the resin laminated sheet. SOLUTION: The resin laminated sheet is constituted by forming outer layers, each of which is constituted of a resin composition (B) containing a styrenic resin and a styrene/butadiene block copolymer, on both surfaces of a base material layer constituted of a resin composition (A) containing a styrenic thermoplastic elastomer and a styrenic resin. A ratio of the melt index (MIA) of the composition (A) constituting the base material layer and the melt index (MIB) of the composition (B) constituting the outer layers is MIA/MIB=0.7-3. This sheet is secondarily molded to obtain the molded product for feeding electronic parts.</p>
申请公布号 JP2002283502(A) 申请公布日期 2002.10.03
申请号 JP20010082950 申请日期 2001.03.22
申请人 DAICEL POLYMER LTD 发明人 HAYASHI JUNICHIRO
分类号 B65D1/00;B32B25/08;B32B27/30;B65D1/09;B65D65/40;B65D73/02;B65D85/86;C08L25/04;C08L51/00;C08L53/02;(IPC1-7):B32B25/08 主分类号 B65D1/00
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