| 发明名称 |
WAX-CONTAINING MELT MIXTURE, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device-sealing epoxy resin composition excellent in adhesiveness and releasability. SOLUTION: The composition is characterized in that it comprises (A) an inorganic filler, (B) a wax-containing melt mixture, and (C) a hardening accelerator.
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| 申请公布号 |
JP2002284853(A) |
申请公布日期 |
2002.10.03 |
| 申请号 |
JP20010084915 |
申请日期 |
2001.03.23 |
| 申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
UEDA SHIGEHISA |
| 分类号 |
C08K3/36;C08G59/62;C08L63/00;C08L91/06;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 |
主分类号 |
C08K3/36 |
| 代理机构 |
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