发明名称 |
Microelectronic assembly with die support and method |
摘要 |
A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.
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申请公布号 |
US2002142514(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20010819393 |
申请日期 |
2001.03.28 |
申请人 |
SCHEIFERS STEVEN M.;SKIPOR ANDREW;GAMOTA DANIEL |
发明人 |
SCHEIFERS STEVEN M.;SKIPOR ANDREW;GAMOTA DANIEL |
分类号 |
H01L21/60;H01L21/56;H01L23/31;(IPC1-7):H01L21/44;H01L21/48;H01L21/50;H01L23/06;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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