发明名称 |
AQUEOUS CLEANING COMPOSITION CONTAINING COPPER-SPECIFIC CORROSION INHIBITOR FOR CLEANING INORGANIC RESIDUES ON SEMICONDUCTOR SUBSTRATE |
摘要 |
A semiconductor wafer cleaning formulation, including 1-21% wt. fluoride source, 20-55% wt. organic amine(s), 0.5-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 23-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.
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申请公布号 |
WO02077120(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
WO2002US09401 |
申请日期 |
2002.03.27 |
申请人 |
ADVANCED TECHNOLOGY MATERIALS, INC. |
发明人 |
WOJTCZAK, WILLIAM, A.;SEIJO, FATIMA, MA.;BERNHARD, DAVID;NGUYEN, LONG |
分类号 |
C11D7/10;C09K13/08;C11D7/26;C11D7/32;C11D7/60;G03F7/42;H01L21/02;H01L21/027;H01L21/304;H01L21/306;H01L21/3065;H01L21/311;H01L21/321;H01L21/3213;(IPC1-7):C09K13/00;C09K13/06 |
主分类号 |
C11D7/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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