| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in crack resistance and adhesiveness. SOLUTION: This semiconductor-sealing material consists of (A) an epoxy resin containing a 2-functional epoxy compound having the following (I) and/or (II) structures (wherein, R1 to R10 are each H or methyl), (B) a curing agent containing a phenolic curing agent having the following (III) or (IV) structures (wherein, R11, R12 are each any of H, methyl or phenyl; R13 to R16 are each H or a 1-5C hydrocarbon group; and R17 to R20 are each H or a 1-5 hydrocarbon group), (C) a filler and further (D) a silane coupling agent, and the semiconductor device using the same is also provided.
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