发明名称 Bonding a substrate to a polymeric material
摘要 A substrate is bonded to a polymeric material based on a plastics material on an elastomeric block copolymer according to DT. P1908810.9 and present modification consists of contacting teh substrate with a polymeric cpd. in presence of (A) a polyhydroxy compd. of formula: and (II) which is as in (I), with a further bridging radical of formula: between and ring B. R1-14 cam be H, OH, alkyl, allyl, aryl, or aralkyl gp and at least one of R1-5 and at least one of R6-10 is OH Further, at least one H atom is o- or p- to the OH gps. in both rings, and (B) a cpd. capable of reacting with (A) to form an aldehyde condensation resin, followed by heating to effect curing.
申请公布号 DE2033078(A1) 申请公布日期 1971.02.04
申请号 DE19702033078 申请日期 1970.07.03
申请人 发明人
分类号 B29C65/00;C03C17/32;C08G8/00;C08G8/08;C09J157/00;C09J161/06 主分类号 B29C65/00
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