发明名称 |
A TO-CAN HAVING A LEADFRAME |
摘要 |
The present invention relates to a TO-can type encapsulating element for enclosing, either hermetically or non-hermetically, optical-electrical chips with integrated optical element interfaces, detachable fibres and leadframes. The TO-can/encapsulating element enables the optical fibre (9) to be readily positioned relative to the chip (25) with the aid of a fix-able can-flange (7), and eliminates the risk of crack formation by virtue of the component leads of said TO-can having been provided with and connected to a leadframe (6). |
申请公布号 |
WO02078409(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
WO2002SE00582 |
申请日期 |
2002.03.22 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL);BLOM, CLAES;ALBORNOZ DAVILA, NIVARDO |
发明人 |
BLOM, CLAES;ALBORNOZ DAVILA, NIVARDO |
分类号 |
G02B6/42;H01L31/0203;H01L31/0232 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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