| 摘要 |
<p>Wafer scale processing techniques produce chip-laser-diodes with an active region (62) and a diffraction grating (76) that redirects output light out the top and/or bottom surfaces. The diffraction grating (76) redirects a novel feedback from the optical output (e.g., fiber (74)) to produce lasing that self-aligns itself to the fiber input, reducing assembly costs. Preferably, a diffraction grating (76) and integrated lens-grating are used herein to couple light from the chip to an output fiber (74), and the lens-grating is spaced from the diffraction grating (76). Combination grating and additional gratings and/or integrated lenses on the top or bottom of the diode can also be made utilizing wafer scale processes.</p> |
