SEMICONDUCTOR STRUCTURES HAVING MULTIPLE CONDUCTIVE LAYERS IN AN OPENING, AND METHODS FOR FABRICATING SAME

摘要

In some embodiments, a circuit structure comprises a semiconductor substrate (110), an opening (130) passing through the substrate between a first side of the substrate and a second side (110B) of the substrate, and a plurality of conductive layers (210, 320) in the opening. In some embodiments, one conductive layer provides an electromagnetic shield that shields the substrate from AC signals carried by a contact pad (320C) made from another conductive layer on a backside of the substrate. The conductive layers can also be used to form capacitor/rectifier networks. Manufacturing methods are also provided.