| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring abnormality detection method of a device capable of early detection of a defective spot, and history management/tendency grasp by continuous inspection. SOLUTION: This device capable of installing plural optional appliances on the device body has a semiconductor integrated circuit equipped with a data transfer means for performing data transfer between substrates as substrate interface control, wiring for connecting each semiconductor integrated circuit on each substrate, and a central operation means 11 for controlling each part of the device. The device is constituted so that a series of wiring abnormality detection wherein a semiconductor integrated circuit on the substrate and a semiconductor integrated circuit on the substrate, or each semiconductor integrated circuit on the substrate loaded on the device execute abnormal detection of the wiring between the substrates by using the data transfer means and transmits the result of the abnormal detection of the wiring to the central operation means 11 is controlled by a control device 70 connected to the device 1, and that the inspection result is transmitted from the central operation means 11 to the control device 70. |
