APPARATUS FOR RESIN SEALING OF SEMICONDUCTOR WAFER, MOLD FOR MANUFACTURING SEMICONDUCTOR DEVICE, GATE APPARATUS FOR RESIN SEALING OF SURFACE OF SEMICONDUCTOR WAFER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the damage to a semiconductor wafer to the utmost by reducing the force applied to the semiconductor wafer to the utmost in a process for mounting the semiconductor wafer in a mold to seal the surface of the wafer with a resin. SOLUTION: An impact relaxing means for reducing the force applied to the semiconductor wafer is provided under a lower mold.