发明名称 CHEMICAL POLISHING SOLUTION
摘要 PROBLEM TO BE SOLVED: To prepare a chemical polishing solution for aluminum or an alloy thereof which smoothens the surface of aluminum or the alloy thereof by chemical polishing, and can impart sufficient luster to the surface subjected to the chemical polishing without incorporating nitric acid therein. SOLUTION: Inorganic acid other than nitric acid and a tungsten compound are blended to prepare the chemical polishing solution. As the inorganic acid, sulfuric acid and phosphoric acid are preferably used, and also, copper ions, iron ions, or the like, are preferably blended therein.
申请公布号 JP2002285360(A) 申请公布日期 2002.10.03
申请号 JP20010084308 申请日期 2001.03.23
申请人 MITEJIMA KAGAKU KK 发明人 OBARA HARUO;ONO HIROSHI
分类号 C23F1/20;C23F3/03;(IPC1-7):C23F1/20 主分类号 C23F1/20
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