| 摘要 |
<p>The present invention is a method and apparatus for conditioning a polishing pad (108) used for chemically mechanically polishing semiconductor wafers. The conditioning device (107) includes a rigid elongated element (300) that resists bowing or warping during the conditioning process. Abrasive elements (303) are supported by a substantially planar bottom surface of the rigid element (300). The abrasive elements (303) may have a diamond layer cut into a grid pattern to provide an abrasive surface. The conditioning device (107) is preferably used to condition a polishing pad (108) supported by a rigid platen (211). The conditioning device (107) is pressed against and swept across the polishing pad (108) by an actuator (104) while the polishing pad (108) is rotated to uniformly condition the polishing pad (108). This uniform conditioning, while avoiding the bowing and warping of the prior art, provides a superior conditioning process for the polishing pad(108).</p> |
