发明名称 |
FABRICATION METHOD OF SO1 SEMICONDUCTOR DEVICES |
摘要 |
The present invention relates to a method for fabrication of semiconductor devices, in particular but not limited to the fabrication of double gate transistors of the type Gate-All-Around or "semiconductor-on-nothing" transistors and devices. A method according to the present invention comprises the steps of: (a) forming a trench in a least a first substrate, (b) transferring semiconductor material over the trench to form a semiconductor bridge across the trench, the semiconductor bridge defining an active area. The bridge may be free to oscillate above the trench without using removing a sacrificial layer. The method may also include the steps of: (c) forming a gate insulator on the semiconductor bridge, and (d) applying gate material on the gate insulator, thus forming a gate.
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申请公布号 |
WO02078075(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
WO2002BE00043 |
申请日期 |
2002.03.25 |
申请人 |
UNIVERSITE CATHOLIQUE DE LOUVAIN;FLANDRE, DENIS;NEVE DE MEVERGNIES, AMAURY;RASKIN, JEAN-PIERRE |
发明人 |
FLANDRE, DENIS;NEVE DE MEVERGNIES, AMAURY;RASKIN, JEAN-PIERRE |
分类号 |
H01L21/335;H01L21/336;H01L21/762;H01L29/423;H01L29/786;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/335 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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