| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photosensitive solder resist composition excellent in characteristics such as resistance against gold plating, resistance against thermal shock and electric insulating property. SOLUTION: The composition contains (A) a resin containing radical polymerizable groups and carboxyl groups obtained by adding cyclic ether groups of vinyl monomers containing cyclic ether groups to carboxyl groups of radical copolymers containing at least cyclohexylmethacrylates and vinyl monomers containing carboxyl groups as the monomer units, (B) an inorganic filler, and (C) a photosetting mixture consisting of polyfunctional acryl monomers (c1), compounds having cyclic ether groups (c2) and a photopolymerization initiator (c3). |
