ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE AND COPPER-CLAD LAMINATE, SUBSTRATE FOR SEMICONDUCTOR BONDING AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive tape for a semiconductor device capable of reducing warpage, having excellent punchability, and a copper-clod laminate and the semiconductor device using the same. SOLUTION: This adhesive tape for a semiconductor is characterized in that the tape is constituted of a laminate of an organic insulative film layer and at least one or more layers of adhesive layers and the heat shrinkage of the organic insulative film layers is 0.04-0.3%.