发明名称 WATER-BASED PHOTOSENSITIVE SOLDER RESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a water-based photosensitive solder resist composition which is excellent in characteristics such as resistance against gold plating, resistance against thermal shock and electric insulating property, which can decrease VOC(volatile organic compound) and which has preferable photosensitivity. SOLUTION: The water-based photosensitive solder resist composition contains (A) a resin prepared by neutralizing the following resin (a) with reactive amines having radical polymerizable groups to make the resin soluble in water, (B) an inorganic filler, and (C) a photosetting mixture consisting of polyfunctional acryl monomers (c1), compounds having cyclic ether groups (c2) and a photopolymerization initiator (c3). The resin (a) contains radical polymerizable groups and carboxyl groups and is obtained by adding cyclic ether groups of vinyl monomers containing cyclic ether groups to carboxyl groups of radical copolymers containing at least isobornyl (meth)acrylates and vinyl monomers containing carboxyl groups as the monomer units.
申请公布号 JP2002287355(A) 申请公布日期 2002.10.03
申请号 JP20010092196 申请日期 2001.03.28
申请人 NIPPON PAINT CO LTD 发明人 YABUUCHI NAOYA;FUJITA MINORU;NANBA OSAMU;OKAJIMA KEIICHI
分类号 G03F7/038;C08G59/42;C08K3/00;C08K5/103;C08L63/00;G03F7/004;G03G9/08;G03G9/087 主分类号 G03F7/038
代理机构 代理人
主权项
地址