POLISHING METHOD AND GRINDING/POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a polishing method capable of removing a processing distortion existing on a back surface of a semiconductor wafer by polishing the back surface thereof with a high polishing efficiency and a high polishing quality and a grinding/polishing including the polishing method. SOLUTION: The back surface of the semiconductor wafer W is ground by a grinding member and thereafter, the back surface of the semiconductor wafer W is polished by rotating the semiconductor wafer W and a polishing means 6 and pressing the polishing means 6 to the back surface of the semiconductor wafer W. The polishing means is constituted by dispersing an abrasive grain in a felt of which a density is 0.20 g/cm<3> or more and a hardness is 30 or more.