Method for cleaning substrate and apparatus therefor

摘要

A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a throughput. A substrate such as a wafer or the like placed in a cleaning tank filled therein with a cleaning liquid is cleaned by an ultrasonic vibration. Cleaning of the substrate is carried out in such a manner that an ultrasonic vibration is applied to the substrate from a bottom of the cleaning tank, during which application the substrate is kept at a predetermined inclination angle with respect to a direction of acoustic streaming in the cleaning liquid formed by propagation of an ultrasonic wave.