发明名称 SPUTTERING TARGET MATERIAL
摘要 <p>A sputtering target material which comprises an Ag alloy comprising Ag, a specific small amount of a metal component (A) selected from among In, Sn and Zn and a specific small amount of a metal component (B) selected from among Au, Pd and Pt and optionally a small amount of Cu. The sputtering target material has a high reflectance and also exhibits excellent resistance to sulfurization.</p>
申请公布号 WO2002077317(P1) 申请公布日期 2002.10.03
申请号 JP2002002466 申请日期 2002.03.15
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