| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device for reducing damage of a semiconductor wafer by vibration by preventing the vibration of a rotary shaft of a polishing surface plate at polishing time. SOLUTION: Since a cross roller bearing 25 is incorporated into a bearing 22 of the polishing surface plate 11, at reciprocatably polishing time of a silicon wafer W, the cross roller bearing 25 receives both a thrust load and a radial load acting on the rotary shaft 18 of the polishing surface plate 11. As a result, even if polishing is performed over a long period, an abrasion quantity of a bearing for receiving the thrust load and a bearing for receiving the radial load always become the almost same to thereby prevent the vibration of the rotary shaft 18 at polishing time conventionally generated by a difference in the abrasion quantity of both bearings as well as to reduce damage of the silicon wafer W by this vibration. |
