发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in tent film strength and deformed through hole reliability without impairing sensitivity, resolution, adhesion to a substrate, resist removability, etc. SOLUTION: The photosensitive resin composition contains a binder resin (A), an ethylenically unsaturated compound (B) and a photopolymerization initiator (C), and the component (B) contains an acrylic compound having urethane bonds represented by formula (1) (where R is H or a 1-3C alkyl; R1 and R2 are each a 2-5C alkylene; X is a 2-20C divalent hydrocarbon, the symbols X are different or identical; Y is a divalent group obtained by removing H atoms from both OH groups of bisphenol; m, m', n and n' are each an integer of 0-30; and l and l' are each an integer of 1-10).
申请公布号 JP2002287347(A) 申请公布日期 2002.10.03
申请号 JP20010087136 申请日期 2001.03.26
申请人 NICHIGO MORTON CO LTD 发明人 HIUGA ATSUYOSHI;TAKAMIYA HIROYUKI
分类号 G03F7/027;C08F2/44;C08F2/50;C08F291/00;G03F7/004;G03F7/031;G03F7/033;H05K3/00 主分类号 G03F7/027
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