| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide die-attach paste having nonconductive characteristics and excellent bleeding-resistance. SOLUTION: This nonconductive die-attach paste comprises (A) a urethane di(meth)acrylate obtained by reacting a hydroxyalkyl (meth)acrylate, a polyalkylene glycol and a diisocyanate, (B) an acrylate having volatility, (C) a radical polymerization catalyst, and (D) a nonconductive filler as essential components.</p> |
