| 摘要 |
PROBLEM TO BE SOLVED: To improve a lead wire connecting method to provide a highly sensitive platinum sensor capable of reducing its size. SOLUTION: After a temperature sensing part 2 of a platinum thin film is formed in a plane insulated substrate 1, two L-shaped electrodes 3 different in their sizes are arranged asymmetrically, and a conductor of low resistance excellent in close contacting force to platinum and the insulated substrate, and capable of forming a rectangular shape easily is formed in a long side part of the each L-shaped electrode of a thin and small size contacting with the temperature sensing part.
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