发明名称 |
High density, miniaturized arrays and methods of manufacturing same |
摘要 |
High-density, miniaturized arrays including high surface areas. Arrays described include substrate with a coating of linking agents, as well as arrays with reactants affixed to the substrates. Methods of manufacturing high-density arrays of reactants. The methods include the use of oriented, heat shrink films and elastomeric materials. Methods of functionalizing a substrate with linking agents for subsequent affixation of reactants are also disclosed herein.
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申请公布号 |
US2002143110(A1) |
申请公布日期 |
2002.10.03 |
申请号 |
US20020060794 |
申请日期 |
2002.01.30 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
HALVERSON KURT J.;PATIL SANJAY L.;RASMUSSEN JERALD K. |
分类号 |
G01N33/53;B01J19/00;C12M1/00;C12N15/09;C12Q1/68;C40B40/06;G01N33/543;G01N37/00;(IPC1-7):C08F8/30 |
主分类号 |
G01N33/53 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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