| 摘要 |
An electronic package which has a thermally conductive member encapsulated with the semiconductor chip; and which is adapted for chip-scale or near-chip-scale applications of both wire-bond and flip-chip packages. For adhesively bonding the semiconductor chip to a circuitized carrier or substrate on which the chip is positioned, and to concurrently form an encapsulating structure protecting the semiconductor chip, there is provided a mold compound, such as a thermosetting plastic resin or epoxy to not only extend between the surface of the circuitized substrate or carrier facing the semiconductor chip, and possibly about the peripheral sides of the carrier, but to also at least extend over and encompass the peripheral edge portions of the opposite surface of the carrier or circuitized substrate distal to or facing away from the chip.
|
