<p>A lead-free solder paste suitable for soldering chip parts includes a powder of a twin-peak Sn-based solder alloy containing 0.2 - 1.0 mass % of Ag and a flux. The solder alloy has a first peak of heat absorption in a differential scanning calorimeter curve at the start of melting and a second peak when the major portion of the alloy subsequently melts. <IMAGE></p>