| 摘要 |
PROBLEM TO BE SOLVED: To provide a tool for punching a semiconductor lead L, whose working life is extended by improved abrasion resistance, which can besides prevent the adhesion of melt, etc., generated by a reaction with a nonferrous metal composing the lead L, and which is furthermore easily produced and machined. SOLUTION: The tool is used for punching the semiconductor lead L. A punch side working part 8 and a die side working part 4, both of which are comb tooth-shaped, are provided on a punch 1 and a die 2, respectively, which face each other in a relatively contactable/separable state. The lead L of a semiconductor package, which is placed on the die side working part 4, is cut and punched between the punch side working 8 and the die side working part 4 by making these working parts 8 and 4 cross each other. The tip part of the punch side working part 8 and the portion of the die side working part 4, which crosses the punch side working part 8, are coated with diamond-coating films 9 and 10, respectively. |
