发明名称 COOLING APPARATUS AND COOLING METHOD FOR FLAT MATERIAL TO BE COOLED
摘要 PROBLEM TO BE SOLVED: To provide a cooling apparatus and cooling method which can give uniform temperature distribution after cooling in a top region in the transportation direction of a flat material to be cooled, in the cooling method to cool the material to be cooled by spouting cooling liquid on upper and/or lower surfaces of the flat material being transported horizontally. SOLUTION: In the cooling method to cool the material to be cooled by spouting the cooling liquid on the upper and/or lower surfaces of the flat material being transported horizontally, the cooling method includes multiple cooling processes to cool the material in a cooling zone of a designated length in the transportation direction of the material, and the multiple cooling processes include ones which start spouting of the cooling liquid in the cooling zone after the top of the material enters it and the others which start spouting of the cooling liquid in the cooling zone before the top of the material enters it.
申请公布号 JP2002282928(A) 申请公布日期 2002.10.02
申请号 JP20010085166 申请日期 2001.03.23
申请人 SUMITOMO METAL IND LTD 发明人 HARAGUCHI YOICHI;OZEKAWA ATSUSHI
分类号 B21B45/02;C21D1/00;(IPC1-7):B21B45/02 主分类号 B21B45/02
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