| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of soldering a contact pin by which contact pins are disposed in a plane at a narrow pitch, excellent maintainability is obtained, variance in height of inspection electrodes is sufficiently aborbed, stable contact with the inspection electrodes is obtained and a probe card enabling high-speed signal transmission is realized, and to provide a contact pin. SOLUTION: In this method of soldering contact pin in which the contact pin connected to and brought into contact with the inspection electrodes for a semiconductor chip in order to inspect the electric characteristic of the semiconductor chip is erected on a surface of a circuit board of the probe card, a soldering pedestal for the contact pin and solder balls are disposed close to each other on an electrode pad of the circuit board, the solder balls are melted to form a solder fillet between the electrode pad ad the soldering pedestal, and this soldering pedestal is fixed to the electrode pad.</p> |
