Vorrichtung zur Wärmebehandlung von einzelnen Wafern und Verfahren zur Herstellung eines Reaktorgefässes dafür

摘要

A wafer heat-treatment apparatus is known, comprising a reactor vessel having a ceiling portion and a side portion, and heater or heaters installed outside or inside the reactor vessel, whereby a single wafer is disposed at a predetermined position in the vessel for heat-treatment by means of heat from the heater or heaters. To provide a single-wafer heat-treatment apparatus with securement of enough strength in heat-treatment of a semiconductor wafer of an enlarged diameter of as large as 8 inches to 12 inches and improved working efficiency in exchange of wafers and facilitation of operation in a single-wafer heat-treatment, it is suggested that at least a heated region of the reactor vessel is manufactured as substantially a single quartz glass body with no welded portion, and at least a part of the heated region is translucent or opaque by bubbles distributed almost throughout the bulk of the region.