| 摘要 |
The invention relates to a method for separating a semiconductor wafer from a carrier to which said semiconductor wafer is applied by means of an adhesive. The edge of the semiconductor wafer is first etched by means of an edge etching agent, said semiconductor wafer being then completely separated by means of a suction device acting on the upper surface thereof. Said suction device works with a suction flow of oscillating strength, and comprises, similar to a quenching agent, a concave lower surface having suction openings, said lower surface performing a rolling movement on the wafer. |
