A flux composition for lead free solder comprises epoxy resin and organic carboxylic acid

摘要

A flux composition for lead free soldering comprises an epoxy system resin (A) and an organic carboxylic acid (B). They occupy 80 weight % of the composition. The equivalent amount of carboxylic group in (B) to 1.0 equivalent amount of epoxy group in (A) is 0.8-2.0. Independent claims are included for another composition with different ratio of equivalent amounts.