SOLDER PASTE COMPOSITION AS WELL AS SOLDER JOINED PART USING THE SAME, SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a solder paste which does not require cleaning and removing of a residual flux after solder joining, maintains electrical insulatability in spite of a high-temperature and high-moisture atmosphere and has high joining strength and reliability. SOLUTION: A compound (A) having a phenolic hyxroxyl group and carboxyl group, a resin (B), such as an epoxy resin and isocyanate resin, acting as its hardener and a solvent (C) having a hydroxyl group and having a boiling point of >=150 deg.C are compounded as essential components.