Process for heating a substrate comprises placing the substrate onto a heating device covered with a glass ceramic plate, heating from below to the process temperature for the coating, and removing from the heating device, and coating

摘要

Process for heating a substrate comprises placing the substrate onto a heating device (3) covered with a glass ceramic plate (2) and having a recess (4) for the substrate; heating the substrate from below to the process temperature for the coating; and removing the substrate from the heating device and inserting into a coating chamber and coating. An Independent claim is also included for a device for heating a substrate. Preferred Features: The glass ceramic plate consists of two detachable plates having different openings. The temperature in the heating device is 500-800 deg C. The coating process is carried out using CVD, PVD, PECVD, PICVD, LPCVD or TCVD.