发明名称 |
Module cover assembly with door latch transmission mechanism for wafer transport module |
摘要 |
A module cover is equipped with at least one door latch transmission mechanism for closing the entrance of a wafer transport module, each door latch transmission mechanism includes a door latch supported on a roller at the module cover, a latch bolt pivotally coupled between one end of the door latch and a part of the module cover, and a driving wheel coupled to the module cover and rotated to move the door latch forwards and backwards and to further turn the latch bolt in and out of a through hole on the module cover and a respective latch hole on the wafer transport module to lock/unlock the module cover.
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申请公布号 |
US6457598(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US20010811473 |
申请日期 |
2001.03.20 |
申请人 |
PROSYS TECHNOLOGY INTEGRATION, INC. |
发明人 |
HSIEH CHANG YU;CHEN JONE NAN |
分类号 |
H01L21/673;(IPC1-7):B65D85/48 |
主分类号 |
H01L21/673 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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