发明名称 Module cover assembly with door latch transmission mechanism for wafer transport module
摘要 A module cover is equipped with at least one door latch transmission mechanism for closing the entrance of a wafer transport module, each door latch transmission mechanism includes a door latch supported on a roller at the module cover, a latch bolt pivotally coupled between one end of the door latch and a part of the module cover, and a driving wheel coupled to the module cover and rotated to move the door latch forwards and backwards and to further turn the latch bolt in and out of a through hole on the module cover and a respective latch hole on the wafer transport module to lock/unlock the module cover.
申请公布号 US6457598(B1) 申请公布日期 2002.10.01
申请号 US20010811473 申请日期 2001.03.20
申请人 PROSYS TECHNOLOGY INTEGRATION, INC. 发明人 HSIEH CHANG YU;CHEN JONE NAN
分类号 H01L21/673;(IPC1-7):B65D85/48 主分类号 H01L21/673
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