| 摘要 |
A technique for increasing electronic component density on circuit boards is disclosed. In one embodiment, the technique is realized as an improved electronic circuit board for enabling the stacking of electronic components. The electronic circuit board has an electrically conductive signal layer formed on a dielectric layer, wherein the electrically conductive signal layer has a plurality of electrically conductive pads formed therein. The improvement comprises a cavity in the electronic circuit board extending through the electrically conductive signal layer and the dielectric layer. The cavity is sized to accommodate a first electronic component therein such that at least one first electrical connection may be formed between the first electronic component and a first portion of the plurality of electrically conductive pads, and at least one second electrical connection may be formed between a second electronic component, which is stacked over the first electronic component, and a second portion of the plurality of electrically conductive pads.
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