发明名称 |
Electronic component, communication device, and manufacturing method for electronic component |
摘要 |
An electronic component includes an electronic component element and a package to house the electronic component element. The package includes a concave area in which the electronic component element is housed, an area for a sealing frame which is located along the periphery of the concave area, and a sealing cover which is mounted on the area for a sealing frame so as to cover the concave area. Connecting electrodes are electrically connected to the electronic component element and a conductive pattern to be used for image recognition is provided on the upper surface of the area for a sealing frame.
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申请公布号 |
US6459149(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US20000696708 |
申请日期 |
2000.10.25 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SHIMOE KAZUNOBU;KITA RYOICHI |
分类号 |
H01L21/60;H01L23/04;H01L23/057;H01L23/10;H01L23/498;H01L23/50;H01L23/544;(IPC1-7):H01L23/12 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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