发明名称 |
Etched tri-layer metal bonding layer |
摘要 |
A tri-metallic material for use in the manufacture of printed circuit boards is described, and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the "bread" of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.
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申请公布号 |
US6459041(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US20000703815 |
申请日期 |
2000.11.01 |
申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
ACHARI ACHYUTA;GOENKA LAKHI NANDLAL;PARUCHURI MOHAN R. |
分类号 |
H05K1/09;B23K35/14;B32B15/01;C23C2/26;C23C2/28;C23C26/00;H05K3/02;(IPC1-7):H01B7/08 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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