发明名称 |
Pressure modulation method to obtain improved step coverage of seed layer |
摘要 |
A multi-step process for the deposition of a material into high aspect ratio features on a substrate surface is provided. The process involves depositing a material on the substrate at a first pressure for a first period of time and then depositing the material on the substrate at a second pressure for a second period of time. Modulation of the pressure influences the ionization and trajectory of the particles, which are ionized in a plasma environment. The method of the invention in one aspect allows for optimum deposition at the bottom of a high aspect ratio feature during a high pressure step and increased deposition on the sidewalls of the feature during at least a low pressure step.
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申请公布号 |
US6458251(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US19990440679 |
申请日期 |
1999.11.16 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SUNDARRAJAN ARVIND;ANGELO DARRYL;DING PEIJUN;CHIN BARRY;HASIM IMRAN |
分类号 |
C23C14/06;C23C14/04;C23C14/14;C23C14/34;C23C14/35;H01J37/32;H01J37/34;H01L21/203;H01L21/28;H01L21/285;H01L21/3205;H01L21/768;H01L23/52;(IPC1-7):C23C14/32 |
主分类号 |
C23C14/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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