发明名称 |
Method for forming aluminum bumps by CVD and wet etch |
摘要 |
A method for forming aluminum bumps that has significantly reduced processing steps than the conventional method is disclosed. The method utilizes a chemical vapor deposition technique for the selective deposition of aluminum into an opening for forming the bump and then a wet etch process for removing a polyimide layer that functioned both as a photoresist layer for providing an opening in a passivation layer and as a support for a via hole during the selective aluminum deposition process. The thickness of the passivation layer and the polyimide layer formed on top of the metal I/O pad is important since it determines the height of the aluminum bump formed.
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申请公布号 |
US6458683(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US20010821930 |
申请日期 |
2001.03.30 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD |
发明人 |
LEE CHENG-WEI |
分类号 |
H01L21/285;H01L21/60;(IPC1-7):H01L21/283 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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