发明名称 |
System and method for facilitating determining suitable material layer thickness in a semiconductor device fabrication process |
摘要 |
The present invention relates to a test wafer for use in optimizing a process. The test wafer includes a substrate and a material layer formed over the substrate, wherein the material layer includes N number of test regions (N being an integer greater than one). At least one of the test regions has a material layer thickness different from another of the test regions. A spindle drive system is also provided for driving at least one spindle. One end of the at least one spindle is coupled to a polishing pad, which is employed in forming the test regions.
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申请公布号 |
US6459945(B1) |
申请公布日期 |
2002.10.01 |
申请号 |
US19990311223 |
申请日期 |
1999.05.13 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
SINGH BHANWAR;MORALES CARMEN;RANGARAJAN BHARATH |
分类号 |
B24B37/04;B24B49/04;H01L21/00;H01L23/544;(IPC1-7):G06F19/00;G01R31/26;H01L21/461;B24B49/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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