Inverse integrated circuit fabrication process

摘要

An inverse IC process provides surface uniformity. A method of fabricating an integrated circuit structure includes a number of interconnect layers and a number of transistors. The method includes providing interconnect layers above a substrate, providing a semiconductor layer above the interconnect layers and providing gate conductors on a top surface of the semiconductor layer. The top surface is opposite a bottom surface. The bottom surface is closer to the interconnect layers than the top surface.