发明名称 |
Light sensitive chemical-mechanical polishing method |
摘要 |
A chemical-mechanical polishing apparatus has a surface formed on a solid aggregate comprising a solid suspension of abrasive particles in a light sensitive material. An ultraviolet light source exposes a thin top layer of the surface and a developing fluid develops the exposed surface. The developing fluid dissolves the UV-exposed top portion of the aggregate and a polishing slurry is formed of the developing fluid and the released abrasive particles. The aggregate surface remaining after developing acts as a polishing surface. The polishing slurry is used during chemical-mechanical polishing of a processed semiconductor wafer. After polishing, a rinsing fluid is dispensed to remove used slurry from the polishing aggregate.
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申请公布号 |
US6458704(B2) |
申请公布日期 |
2002.10.01 |
申请号 |
US20010870349 |
申请日期 |
2001.05.29 |
申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
CARLSON DAVID W. |
分类号 |
B24B37/04;H01L21/306;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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