发明名称 Thermoplastic resin composition
摘要 A thermoplastic resin composition comprising40 to 95 parts by weight of (a) a saponified ethylene-vinyl acetate copolymer resin and60 to 5 parts by weight of (b) at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof, characterized in thatthe saponified ethylene-vinyl acetate copolymer resin (a) has an ethylene content of 40 to 95 wt % based on a weight of the saponified ethylene-vinyl acetate copolymer resin and a degree of saponification of the vinyl acetate of at least 80 wt % and(b)at least one selected from the group consisting of copolymers of a vinyl aromatic compound with a conjugated diene compound is selected from the group consisting of(b-1) block copolymers of a vinyl aromatic compound with a conjugated diene compound, and hydrogenated derivatives thereof and(b-2) hydrogenated random copolymers of a vinyl aromatic compound with a conjugated diene compound, the copolymers having a vinyl aromatic compound content of at most 50 wt %, a number average molecular weight(Mn) of from 5,000 to 1,000,000, a polydispersity(Mw/Mn) of at most 10, and a content of vinyl bonds derived from the conjugated diene compound of at least 10% based on bonds derived from the conjugated diene compound.
申请公布号 US6458893(B1) 申请公布日期 2002.10.01
申请号 US20010904977 申请日期 2001.07.13
申请人 RIKEN VINYL INDUSTRY CO., LTD. 发明人 TASAKA MICHIHISA;YAMANAKA TOSHIMI
分类号 C08L15/00;C08L23/08;C08L23/26;C08L25/10;C08L29/04;C08L33/06;C08L53/02;C08L75/04;(IPC1-7):C08L23/08 主分类号 C08L15/00
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