SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor device is provided to reduce fabricating cost by obviating the necessity of a specific jig by making a heat radiation block/plate have such a size that the outer periphery of the heat radiation block/plate overlaps a lead and by forming an insulator of a tape type on a part of the lead. CONSTITUTION: A semiconductor element(6) is disposed within a space portion defined by the leads(2) of a leadframe(1) or fixed to a die pad(3) of the leadframe and has bonding pads connected to the leads through wires(7) respectively. The heat radiation block/plate(5) is made of a good thermally conductive material and has the outer periphery having a size sufficiently to overlap the leads so that the heat radiation block/plate is disposed on the leads partly through the tape-like insulator(14). The semiconductor element is disposed on a center portion of the heat radiation block/plate directly or through the die pad. The semiconductor device is sealed with resin or the like with part of the leads and an end surface of the heat radiation block/plate left exposed or with part of the leads left exposed.