| 摘要 |
<p>PROBLEM TO BE SOLVED: To propose a printed wiring board excellent in connection reliability wherein position deviation does not exist in formation of a viahole between layers and a conductor circuit, and a manufacturing method of the printed wiring board. SOLUTION: A recessed part is formed by laser in an interlayer resin insulating layer 40 which is arranged on a metal layer 34 on which a roughened surface 34βis formed. In this case, a positioning mark 46 is formed by eliminating the roughened surface 34βof the metal layer 34 which is exposed from a lower part of the recessed part by using laser. When reflection type image processing is performed, difference of contrast between the positioning mark 46 and the other part is large, so that the positioning mark 46 can be exactly recognized. Thereby the conductor circuit can be formed with a high position precision.</p> |
