| 摘要 |
PURPOSE: A method for aligning a pin and a pad in a wafer prober is provided to contact correctly a pin with a pad which are aligned on a chuck of the wafer prober by correcting a twist and a positional variation of a camera mounted on the wafer prober. CONSTITUTION: A wafer is loaded on a chuck of a stage portion of a wafer prober(400). A practical position of a mark camera is detected by a wafer camera(410). The varied amount of mark is calculated by comparing the captured position of the mark with a reference position of the mark(420). A position of a pad is detected by the wafer camera(430). A location of a pin is detected by using a pin camera(440). A movable value of a stage is detected by using the varied amount of the mark and the positions of the pin and the mark(450). The pin is correctly contacted with the pad by moving the stage according to the movable value(460).
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