APPARATUS FOR FIXING WAFER WITH ELECTROSTATIC CHUCK

摘要

PURPOSE: An apparatus for fixing a wafer with an electrostatic chuck is provided to perform stably a semiconductor fabrication process by using one table compatible with an electrostatic chuck for wafer of 200 mm as well as an electrostatic chuck for wafer of 300 mm. CONSTITUTION: A plurality of lift holes(177) are formed on an outside of a lower face of an electrostatic chuck. An AC(Alternating Current) voltage input hole(174a), an AC output hole(174b), a helium gas inlet hole(172a), a helium gas outlet hole(172b), a cooling water inlet hole(170a), a cooling water output hole(170b), an RF voltage input hole(176a), and an RF voltage output hole(176b) are formed along a concentric circle which is formed in an inside of the lift pin holes(177). The cooling water inlet hole(170a) is located nearly to the cooling water outlet hole(170b). The AC voltage input hole(174a) is located nearly to the AC voltage output hole(174b). The RF voltage input hole(176a) is located nearly to the RF voltage output hole(176b). The helium gas inlet hole(172a) faces the helium gas outlet hole(172b). An O-ring(200) is installed in the helium gas inlet hole(172a), the helium gas outlet hole(172b), the cooling water inlet hole(170a), and the cooling water outlet hole(170b), respectively.